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Colfax CX32855i-NVMe4-S24-X8 3U Rackmount Server

 
 
  • Innovative 3U Design with 1U Storage & 2U Compute Nodes (4x 1U Half-Width)
  • 2x 3rd Gen Intel® Xeon® Scalable Processors / Node
  • 16x DDR4 DIMMS + 8x Intel® Optane™ Persistent Memory 200 Series Modules / Node
  • 2x M.2 NVMe SSDs / Node
  • Total 24x 2.5" U.2 NVMe 4.0 Drive Bays
  • Intel® DSG System Debug Log Advisor (SDLA) New

Features

  • Innovative 3U Design with 1U Storage & 2U Compute Nodes (4x 1U Half-Width)
  • 2x 3rd Gen Intel® Xeon® Scalable Processors / Node
  • 16x DDR4 DIMMS + 8x Intel® Optane™ Persistent Memory 200 Series Modules / Node
  • 2x Riser Card Assemblies / Node
    - Each Riser Card supports 1 PCI-E 4.0 x16 Low-Profile Slot & 1 80/110 mm PCIe or SATA M.2 SSD
  • Networking / Node
    - 10Gb Ethernet Port (10GBASE-T)
    - 1Gb Ethernet Port (1000BASE-T) Dedicated to Server Management
  • I/O Ports / Node
    - 1x USB 3.0 Port
    - 1x I/O Breakout Cable Connector Supporting the Following:
    o 2x USB 3.0 Ports (Dual-Stack)
    o 1x VGA Connector (routed to BMC VGA Controller with 16 MB of DDR4 video memory)
    o 1x Serial Port Connector
  • Total 24x 2.5" U.2 NVMe 4.0 Drive Bays
  • Intel® DSG System Debug Log Advisor (SDLA) New
    - Enables customers to quickly and easily identify and resolve for themselves common server support issues
  • 4x 2100W Redundant Power Supplies (2+1 or 2+2 Redundancy), 80PLUS Platinum


Technical Specifications

Chassis Form Factor • 3U Rackmount
• Dimension: 17.32"W (440mm) x 5.15"H (130.8mm) x 29"D (736.6mm)
CPU / Node • Socket Socket-P4 4189
• Dual 3rd Gen Intel® Xeon® Scalable Processors
• Supports Max CPU TDP up to 205W

Note: Supported 3rd Gen Intel® Xeon® Scalable processor SKUs must Not end in (H), (L), or (U). All other processor SKUs are supported.
Note: Previous generation Intel® Xeon® processor and Intel® Xeon® Scalable processor families are not supported
Chipset / Node • Intel® C621A Chipset
Memory / Node • 16x DDR4 DIMMs + 8x Intel® Optane™ persistent memory 200 series modules
• All DDR4 DIMMs must support ECC
• Registered DDR4 (RDIMM), 3DS-RDIMM, Load Reduced DDR4 (LRDIMM), 3DS-LRDIMM
• Intel® Optane™ persistent memory 200 series modules
• Up to 3200 MT/s memory data transfer rates
• Up to 2 TB DDR4 memory capacity (1 TB per processor) for all processor SKUs
• Up to 6 TB DDR4 and Intel® Optane™ PMem combined memory capacity (3 TB per processor), dependent on processor SKU
• DDR4 standard voltage of 1.2 V
I/O Expansion / Node Riser 1
• PCIe slot (from CPU0): x16 (mechanical/electrical) low-profile PCIe 4.0 compatible
• M.2 connector (from chipset): 80/110 mm SATA/PCIe 3.0 NVMe
Riser 2
• PCIe slot (from CPU1): x16 (mechanical/electrical) low-profile PCIe 4.0 compatible
• M.2 connector (from chipset): 80/110 mm SATA/PCIe 3.0 NVMe

Note: The PCIe slots in riser 1 and 2 provide up to 25 W of power.
Networking / Node • One external 10GBASE-T Ethernet port (RJ45)
• One external 1000BASE-T Ethernet port (RJ45) dedicated for server management
Video / Node • Integrated 2D video controller
• 16 MB of DDR4 Memory
• One VGA DB-15 external connector through I/O breakout cable
I/O Ports / Node • One USB 3.0 port
• One I/O breakout cable connector supporting the following:
o Two USB 3.0 ports (dual-stack)
o One VGA connector (routed to BMC VGA controller with 16 MB of DDR4 video memory)
o One serial port connector. The port follows AT pinout specifications

Note: The I/O breakout cable is available as an option
Cooling • Four dual-rotor 80 mm hot-swap fans with support for fan redundancy
• Six hot-swap dual-rotor 40 mm fans with support for fan redundancy
• One fan per installed power supply unit (PSU)
Power Supply • Up to four 2100-watt AC power supplies with power redundancy support (2+1 or 2+2)
• 80PLUS Platinum Certified
Rack Mount Kit • Tool-less installation
• Travel distance: 536mm
• Max supported weight: 60kg
Serviceability Modular chassis features for simplified serviceability:
• Fully independent warm-swappable modules
• Hot-swappable power supplies
• Hot-swappable front fans
• Hot-swappable U.2 solid state drive (SSD) storage
Security Support • Intel® Platform Firmware Resilience (Intel® PFR) technology
• Intel® Software Guard Extensions (Intel® SGX)
• Intel® Total Memory Encryption (Intel® TME)
• Intel® CBnT – Converged Intel® Boot Guard and Trusted Execution Technology (Intel® TXT)
• Trusted platform module 2.0 – iPC AXXTPMENC8 (accessory option)
Server Management • Integrated baseboard management controller (BMC) based on the ASPEED* AST2500 Advanced PCIe* Graphics and Remote Management Processor
• Intelligent Platform Management Interface (IPMI) 2.0 compliant
• Redfish* compliant
• Support for Intel® Data Center Manager (DCM)
• Support for Intel® Server Debug and Provisioning Tool (SDPTool)
• One external 1000BASE-T Ethernet port (RJ45) dedicated for server management
• Onboard LEDs for Light Guided Diagnostics
BIOS • Unified Extensible Firmware Interface (UEFI)-based BIOS (legacy boot not supported)
Operating Temperature • 10–35 °C ambient temperature


Block Diagram


Images

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$17,831.60
 

  Qty.Colfax CX32855i-NVMe4-S24-X8 3U Rackmount Server, Cost As Configured $6,195.45
Chassis 1
   Colfax CX32855i-NVMe4-S24-X8 3U Rackmount Server, Cost As Configured $6,195.45